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Additive Manufacturing Simplified
Specifically designed to meet the needs of businesses and educators, the UP300 is targeted for users demanding a large build volume along with a consistent 3D Printing experience across various materials.
Double sides build platforms - The removable glass backed print bed is double sided and features a different printing surface on each side. Print your models on the smooth glass bed, a textured printing surface or the popular perforated fiberboard. Each surface offers different benefits depending on the material you are using.
Specialized Extruders - The UP300 ships with three specialized print heads which are optimized to improve material versatility and compatibility with a range of different materials across many different printing temperatures. Print high temperature materials like PC and ASA with the full metal 'ABS' extruder and low temperature materials like PolyCast with the PTFE lined 'PLA' extruder. With the enclosure, high temperature extruder and heated bed, the UP300 is capable of printing a wide range of materials including and not limited to; PLA / PETG / ABS / ABS+ / ASA / PC / TPU / PVB (PolySmooth) / PolyCast and more!
Visit our shop to learn full details about the Tiertime UP300.
Printing TechnologyFused filament fabrication (FFF)Build Volume205 × 255 × 225 mm (X,Y,Z)Print HeadSingle (Includes 3 specialized extruders)Extruder TemperatureUp to 299°CHeated BedYes (Up to 100℃)Material CompatibilityABS, ABS+, ASA, PC, PLA, PETG, TPU, PolySmooth™, PolyCast™ and moreMinimum Layer Thickness50 microns (0.05mm)Platform LevelingManual or AutomaticBuild Platform TypeDouble sided: Perforated / Glass buildplate or Smooth / GlassTouch Screen7″ colour LCD screenBundled SoftwareUP StudioCompatible Formatsup3, .ups, .tsk, .stl, .obj, .3mf, .ply, .off, .3dsConnectivityUSB cable, Wi-Fi, LAN and USB StickOperating SystemWindows 7 (SP1) or higher (32 bit and 64 bit)Mac OS 10.10AC Input110-240VAC，50-60Hz，90WDimensions500 x 523 x 460 mm
Dont know where to start? Or which filament will suit your application?
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